EVG Gemini Automated Production Wafer Bonder with Face to Face Alignment (Item ID: LES-9070 - 2015 vintage)




EVG Gemini Automated Production Wafer Bonder with Face to Face Alignment (Item ID: LES-9070 - 2015 vintage)
Manufacturer: EVG
Model: Gemini
Vintage: 2015
Condition: used
Fully automated operation
Interlocked doors with signal light tower
4 Axis Industrial Robot
EVG CIM Framework Software GUI (Graphical User Interface)
Flexible process flow definition
Drag and drop recipe programming
Parallel processing of multiple jobs
Automated recording of process and machine parameters
Throughput optimized handling sequence
Password protected user access levels
Open cassette loading with empty/present sensor
Wafer size: up to 8"/200mm
Tooling included: 8” bond chucks (additional chucks can be offered)
SmartView®NT Alignment Module with 5x Objectives
4 Bond modules with up to 550°C and 10kN bond force
Formic Acid Bubbler option for purging formic acid vapor into bond chamber
2 purge gas lines for process gas
CE Certified
PDF Manuals
Available for full inspection and demonstration
Installation, training, service and support available