EVG Gemini Automated Production Wafer Bonder with Face to Face Alignment (2014 vintage) (Item ID: LES-9005)




EVG Gemini Automated Production Wafer Bonder with Face to Face Alignment (2014 vintage) (Item ID: LES-9005)
Manufacturer: EVG
Model: Gemini
Vintage: 2014
Condition: used
Refurbishment, warranty, installation, training, service and support available
Available for full inspection and demonstration
Fully automated operation 
Interlocked doors with signal light tower 
4 Axis Industrial Robot 
EVG CIM Framework Software GUI (Graphical User Interface) 
Flexible process flow definition 
Drag and drop recipe programming 
Parallel processing of multiple jobs 
Automated recording of process and machine parameters 
Throughput optimized handling sequence 
Password protected user access levels 
Open cassette loading with empty/present sensor 
Wafer size: up to 8"/200mm 
Tooling included: 8” bond chucks (additional tooling can be offered) 
SmartView®NT Alignment Module with 5x Objectives 
4 Bond modules with up to 550°C and 20kN bond force 
Formic Acid Bubbler option for purging formic acid vapor into bond chamber 
1 purge gas line for process gas 
CE Certified 
All system documentation
Item ID: LES-9005