Manufacturer: EVG
Model: 510
Vintage: 2017
Manual wafer load substrate bonder
Capable of fusion compression bonding
Capable of thermal compression bonding
Ideal for R&D and pilot production applications
High-vacuum capable bond chamber
Windows based control software and operation interface
Wafer size: up to 6”/150mm capable
Max Bond Force: 20 kN
Top side heater: 550°C max. in 1°C steps
Bottom side heater: 550°C max. in 1°C steps
Temperature uniformity: ± 1,5 %Turbo pump and controller
Roughing pump
Load/unload tool
System computer, monitor, and keyboard
PDF Operations Manual for EVG 510 Bonder
Available for full inspection and demonstration
Installation, training, service and support available

Item ID: LES-9073