Manufacturer: EVG
Model: 501
Vintage: 2000
Condition: used
Manual wafer load substrate bonder
Capable of fusion compression bonding
Capable of thermal compression bonding
Capable of anodic bonding
Ideal for R&D and pilot production applications
High-vacuum capable bond chamber
Windows based control software and operation interface
Wafer size: up to 6”/150mm
Max Bond Force: 7 kN
Top side heater: 550°C max. in 1°C steps
Bottom side heater: 550°C max. in 1°C steps
Temperature uniformity: ± 1,5 %
Turbo pump and controller
Roughing pump
Load/unload tool
System computer, monitor, and keyboard
PDF Operations Manual for EVG 501 Bonder
Available for full inspection and demonstration
Installation, training, service and support available with 30 Day Right of Return